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Copper
DIN 1705 bzw. DIN EN 1982
 
   Alloy    EN
 number 		 Density ca.    Composition   
 in % of weight 		 Properties and use
Cu-ETP

DIN EN
13601		 CW004A 
 8,9 Cu ≥ 99.90
inkl. Ag < 0.015
O < 0.040		 Oxygen containing Cu-ETP offers high electrical conductivity, but poor weldability and hard soldering.
Well suited for soft soldering.
 
Important
tempers		 Tensile Strength
Rm
N/mm²		 Yield Stress
Rp0,2
N/mm²		 Elongation
A
%		 Hardness
HB		 Electrical
conductivity
MS/m
Bars

M
R300
R250

*
≥ 300
≥ 250

*
≥ 260
≥ 180

*
≥  8
≥ 15

*
  HB 75 - 100
HB 65 - 90

*
≥ 57.0
≥ 57.0
   * = mechanical properties as manufactured

Comparable Specifications::
E-Cu57, 2.0060, DIN 1787
C11000 UNS
C 101, BS 1433

 

   Alloy    EN
 number 		 Density ca.    Composition   
 in % of weight 		 Properties and use
Cu-TeP

DIN EN
12164		 CW118C 
 8,9 Te 0,4 - 0,7
P 0,003 - 0,012
Cu Balance		 Very good electrical conductivity (min. 50 m/Ω · mm2 at 20 °C). Very good machinability, good cold compressibility and very good heat compressibility. Weldable and hard solderable. For CNC parts amongst others uses.
 
Important
tempers		 Tensile Strength
Rm
N/mm²		 Yield Stress
Rp0,2
N/mm²		 Elongation
A
%
Bars

M
R250

*
≥ 250

*
≥ 180

*
≥  7
   * = mechanical properties as manufactured

Comparable Specifications::
CuTeP, 2.1546, DIN 17666
C14500 UNS
CA 109, BS 2874